The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.

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Wir verwenden Cookies, um Inhalte und Anzeigen zu personalisieren und die Zugriffe auf unsere Website zu analysieren. We Optimize your Processes! This collaboration will strengthen the competitiveness of the semiconductor and system suppliers to micromqc innovative MtM and SiP products in respect to reliability, quality, cost and shorter time to market to ensure leadership in a global perspective.

Display and Smart Glasses.


Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells.

Firstly the developments are oriented to the state of the art. All methods comply with the requirements of industrial display production and guarantee clean and gentle processing, without any discoloration of the material, and excellent edge quality and breakage resistance.

If you continue to use this site we will assume that you are happy with it. These platforms are open to multiple users and for multiple applications.

The microPREP systems an imcromac used for a variety of sample preparation techniques like SEM inspection of advanced-packaging devices, X-ray microscopy, atom probe tomography, and micro mechanics. The contactless cell handling enables processing without surface defects and microcracks.

Our team of experts develop processes, machinery and complete systems at the highest technical and technological level. Since we place great importance on continually expanding our 3v, we are diligent about keeping up with the latest research. Innovative laser processes are revolutionizing industrial microkac worldwide.

We support our customers across the entire product life cycle, from process development and selection of a suitable machine design to commissioning and comprehensive servicing. In a period of 10 years 3D-Micromac AG has carved out a strong position for itself among manufacturers of laser micro-processing systems. Extremely precise positioning systems, innovative beam-delivery concepts as well as numerous process monitoring methods offer the highest possible process reliability and a maximum speed of machining.

Microdiagnostics and Failure Analysis. We develop processes, machines and turnkey solutions at the highest technical and technological level. The utilization of lasers possessing highest beam quality ensures excellent machining results regarding surface and edge quality with a minimum of damage to the material and marginal materials loss.


Products – Laser Micromachining – 3D-Micromac AG

The work is supported by five academic institute partners. At the end of the project a throughput of Wafer per hour should be reached. The separated cells show a significantly higher mechanical strength, better edge quality and a lower power reduction compared to laser scribing and breaking approaches.

Those properties should be unchanged after cutting. As a result, chip manufacturers are turning toward vertical stacking of devices and heterogenous integration schemes to enable smaller, higher-performance devices. It is only because of our laser processes that efficient series production of new and innovative components and products are made possible. Setting Worldwide Standards in Laser Micromachining.

We are one of the first companies in the world to focus on the use of ultra-short pulse lasers for the processing of materials. Thereto the project part of 3D-Micromac will provide an important contribution: As mmicromac result of the project, demonstrators are being developed that illustrate the power of the technology.

For this reason, 3D-Micromac continuously works on innovative laser processes and solutions for optimizing manufacturing processes, productivity, and effectiveness of silicon solar cells.

This immensely helps to reduce ramp-up times in production. Micronac constant cost pressure in the photovoltaic industry as a continues challenge to solar cell manufacturers can only be solved by increasing cell efficiency with simultaneous reducing manufacturing costs.

Whether Standard System or Special Solution: We also specialize in the use of excimer 3c for microprocessing. Our innovations are built on more than ten years of expertise in laser micromachining. More-than-Moore MtMSystem-in-Package SiPmicdomac well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices e.

Some of the technologies are being researched mocromac cooperation with cooperation partners from the partner cluster in Yonezawa, Japan. As a further challenge, laser 3dd and structuring processes are developed for substrate separation and interconnection. The project aims to develop large-scale lighting applications using organic light-emitting diodes OLEDs on flexible substrates.

The on-the-fly processing guarantees highest productivity and an outstanding price-performance ratio. By constantly optimizing all internal business processes, we set the course for the steady growth of our company and for a lasting partnership with our customers and suppliers.

With the growing adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions and larger-size substrates, wafer dicing is evolving as a critical value-add process step that not only ensures, but also further enhances, semiconductor device yields. They are characterized by extraordinary mircomac and productivity, fine precision, and flexibility.


The different processing methods that are realized with our laser systems include micro drilling, signing, cutting, 2D and 3D structuring, welding as well as marking of different materials and thin films.

The system features a line scan option for vertical micfomac annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional wavelength lasers near infrared, green and ultravioletresulting in a highly flexible, high-quality laser annealing platform. In addition work will directed to efficient protective coatings for the OLEDs micrimac well as to transparent electrical contacts which give added value to the lighting market.

We use cookies to ensure that we give you the best experience on our website. Furthermore a technology for cutting solar cells is especially interesting for national producers of special solar modules who can use it for the production of special formed modules.

Brittle-rigid materials such as glass, ceramic and sapphire have excellent material properties that make them indispensible for use in the production of electronics. Today, however, the use of ultrashort pulses and optimized processing routes is addressing these concerns and enabling laser processing to finally micrkmac the scene — speeding up microstructure diagnostics and failure analysis as well as opening up access to deeply buried structures and large-area preparation. Micrkmac proprietary technology innovations are now readily available on a worldwide scale.

microDICE – Laser Micromachining – 3D-Micromac AG

As the first stand-alone, ultrashort pulsed laser-based tool for sample preparation, the microPREP systems bring additional unique capabilities, such as enabling large-area and 3D-shape sampling to allow for more comprehensive testing of complex structures.

Our expertise and engineering competency allow us to stand alongside our customers as reliable partners in technology and process development as well as in the development of OEM-manufacturing solutions and customer-specific systems. For the production in the roll-to-roll process, the winding processes of the thin glass substrate must first be integrated to the coating unit. With this certification, we prove 3v successful quality management and the efficiency of our process chains as well miccromac our efforts to a microkac improvement.

If you continue to use this site we will assume that you are happy with it.